I'm working on a design involving a 223-pin BGA with 0.5mm pitch (ball size 0.3mm) with a 16-bit DDR3 controller involved. Currently routing a track between two balls is resulting in a track width of 0.1mm and a spacing of 0.077mm.
Now the real trick is, I need this design producing rapidly and as suitable for low-cost mass production as possible. Many of the prototyping houses I've approached have quoted 3-5 days for this PCB because of these constraints, one recommendation I've had is to increase spacing to 0.08mm and reduce track width to increase yield but I'm interested to know if anyone else has an opinion on the best way to fan-out this kind of BGA to make it as quick and easy to produce as possible?
how many layers do you have in your board??? how many for signals? what's the via you are using? have you considered using in-pad vias??? they would do you a favor there!
how many layers do you have in your board??? how many for signals? what's the via you are using? have you considered using in-pad vias??? they would do you a favor there!
Currently 6 layers. What's I'm getting at is what approach could a PCB fabrication house produce in the shortest timeframe? i.e. would using micro vias typically be faster to produce than using small track spacing etc. I'm looking for the most effective fanout method to allow for the quickest spin time.
Once you have completed the design, then for production runs the time it takes to manufacture the PCB should not matter, as you would be buying the board in batches so would pre-order PCBs to meet production requirements...
AS you are doing a DDR3 controller then SIGNAL INTEGRITY is your first concern otherwise you will end up with a design that may not work reliably....