Questions about bandgap design and Vdsat

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winsonpku

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bandgap design

Dear all:
I have to questions about bandgap design.
1. What's the effect if we choose too small Vdsat for mos transitor. for 3.3v power supply, how much the Vdsat is used in common?
2. For bipolar transistor, it's very difficuty to match them because the N is always too much, then we still need dummy transistor around them? If no dummy transistor, then how much "erro" will arise?
Thanks all!
 

bandgap design

1. Vdsat - saturation voltage of mos tr. It's minimum voltage drop bitween source/drain below witch mos tr . works in weak inversion region than in triode region. According this a transconductance (gm) of mos tr. decrease, gain decrease, and capacitances icrease.
When u design u must keep appropriated mos tr. in saturation region, i.e. Vds > Vdsat.
Small Vdsat lead to large capacitances and low psrr prefomance.
2. Bipolar tr. is much perfect devices. It's matching is the best. Choose N=8, one tr. in center and 8 around it. No dummy tr. is requered.
 

    winsonpku

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Re: bandgap design

Are you sure most bandgap doesnt' need dummy trans for biapolar trians?
Thanks again

 

bandgap design

It is easy to achive 0.1% accuracy in Vbe, it's depended from sizes and currents thought diodes. And matching increase with technology scaling. Bipolar don't requered dummy tr. I don't see any design with dummy bipolar tr. It's enought for provide 2-3.5% accuracy of Vref without trimming.
 

bandgap design

For 3.3V device, the rule of thumb is 0.3V for vdsat and make sure vds>vdsat in all corners.

Just make your bipolar BIG.
 

Re: bandgap design

Thanks again!

Added after 1 minutes:

Big bipolar will give more accuracy?

dumbfrog said:
For 3.3V device, the rule of thumb is 0.3V for vdsat and make sure vds>vdsat in all corners.

Just make your bipolar BIG.
 

bandgap design

Yes, big bipolar will give much more accuracy. But it have limit (reasobable size & die size . Fab must provide information about mismatch depended on size and forward current thought bip. tr.
 

Re: bandgap design

Band gaps
Common materials at room temperature
Si 1.14 eV
Ge 0.67 eV
InN 0.7 eV
InGaN 0.7 - 3.4eV
InP 1.34 eV
GaAs 1.43 eV
AlGaAs 1.42 - 2.16 eV
AlAs 2.16 eV
InSb 0.17 eV
SiC 6H 3.03 eV
SiC 4H 3.28 eV
GaN 3.37 eV
Diamond 5.46 - 6.4 eV
HgCdTe 0.0 - 1.5 eV

Added after 4 minutes:

In solid state physics
and related applied fields, the band gap (or energy gap) is the energy difference between the top of the valence band and the bottom of the conduction band in insulators and semiconductors. It is often spelled "bandgap".
Image:Semiconductor_band_structure_(lots_of_bands).png
Semiconductor band structure
See electrical conduction and semiconductor for a more detailed description of band structure.

An intrinsic (pure) semiconductor's conductivity is strongly dependent on the band gap. The only available carriers for conduction are the electrons which have enough thermal energy to be excited across the band gap, which is defined as the energy level difference between the conduction band and the valence band. From Fermi-Dirac statistics (to be precise the Boltzmann's approximation is actually used), the probability of these excitations occurring is proportional to:

e^{\left(\frac{-E_g}{kT}\right)}

where:

e is the exponential function
Eg is the band gap energy
k is Boltzmann's constant
T is temperature

Conductivity is undesirable, and larger band gap materials give better performance. In infrared photodiodes, a small band gap semiconductor is used to allow detection of low-energy photons.
Band gaps
Common materials at room temperature
Si 1.14 eV
Ge 0.67 eV
InN 0.7 eV
InGaN 0.7 - 3.4eV
InP 1.34 eV
GaAs 1.43 eV
AlGaAs 1.42 - 2.16 eV
AlAs 2.16 eV
InSb 0.17 eV
SiC 6H 3.03 eV
SiC 4H 3.28 eV
GaN 3.37 eV
Diamond 5.46 - 6.4 eV
HgCdTe 0.0 - 1.5 eV

Band gap engineering is the process of controlling or altering the band gap of a material by controlling the composition of certain semiconductor alloys, such as GaAlAs, InGaAs, and InAlAs. It is also possible to construct layered materials with alternating compositions by techniques like molecular beam epitaxy. These methods are exploited in the design of heterojunction bipolar transistors (HBTs), laser diodes and solar cells.

The distinction between semiconductors and insulators is a matter of convention. One approach is to consider semiconductors a type of insulator with a low band gap. Insulators with a higher band gap, usually greater than 3 eV, are not considered semiconductors and generally do not exhibit semiconductive behaviour under practical conditions. Mobility also plays a role in determining a material's informal classification.

Band gap decreases with increasing temperature, in a process related to thermal expansion. Special purpose integrated circuits such as the DS1621 exploit this property to perform accurate temperature measurements. Band gap also depends on pressure. Bandgaps can be either direct or indirect bandgaps, depending on the band structure.




 

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