neazoi
Advanced Member level 6
Hi, I have tried for first time to solder smd components using a proffessional hot air rework station and solder paste.
I have tried different air speeds and temperatures and different air approaching distances and the results are very dissapointing.
The solder paste is lead-free but it does not seem to joint together easily into a big solder bubble.
Look at the picture (2mb size).
What could the problem be?
I have tried different air speeds and temperatures and different air approaching distances and the results are very dissapointing.
The solder paste is lead-free but it does not seem to joint together easily into a big solder bubble.
Look at the picture (2mb size).
What could the problem be?