dick_freebird
Advanced Member level 7
I am working on an electronic device which will be made up
of layers, each layer will have two chips bump-bonded to
a flex circuit and the N flex circuits most likely wire-bonded to
a rigid base (though perhaps flex to rigid might be bumped
as well).
We could do the flex design / layout separately from the
higher level assembly but a full service shop has a lot of
appeal.
Prefer US based, and looking for someone prototype-friendly
rather than prototyping one place, then having to do a
manufacturing transfer later.
I have seen some interesting work done by "3D-plus" in
France, but our end customers are liable to prefer (fund)
domestic (US) companies.
of layers, each layer will have two chips bump-bonded to
a flex circuit and the N flex circuits most likely wire-bonded to
a rigid base (though perhaps flex to rigid might be bumped
as well).
We could do the flex design / layout separately from the
higher level assembly but a full service shop has a lot of
appeal.
Prefer US based, and looking for someone prototype-friendly
rather than prototyping one place, then having to do a
manufacturing transfer later.
I have seen some interesting work done by "3D-plus" in
France, but our end customers are liable to prefer (fund)
domestic (US) companies.