paralleling connector pins and getting good solder joints?

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treez

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Hello,
Do you believe there is any chance of getting dry joints if four of the adjacent pads of this connector (molex 53398-1071) are fully joined with copper pour on the PCB?...ie, no thermal reliefs on the pads, but instead just literally having them "clumped" into one big copper land. (obviously there would be solder mask over the pads themselves.)
The PCB uses 2 ounce copper. The 4 paralleled pads (connector blades) will be carrying 3.5 Amps of current.

Molex 53398-1071 CONNECTOR
https://www.molex.com/molex/products/datasheet.jsp?part=active/0533981071_PCB_HEADERS.xml

Datasheet of connector
https://www.molex.com/pdm_docs/sd/533981071_sd.pdf
 

I presume you are talking about a state-of-the-art reflow process. It heats the board almost uniformly. If at all, some reflow techniques have problems with very large components like big inductors, but not with copper pours. No problem.

Multiple pins in a copper pour are quite normal for power ICs.
 
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Second that, I do many PCBs where the SMD pads of connector and devices are completely flooded, especially SMPSs and other high current areas...
This should not be a problem to any assembly house or department, if it is they need to look at their processes.
 
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