hmsheng
Full Member level 4
Paper needed
A 2.4-GHz Temperature-Compensated CMOS LC-VCO for Low Frequency Drift Low-Power Direct-Modulation GFSK Transmitters
Toru TANZAWA1, Kenichi AGAWA1, Hiroyuki SHIBAYAMA1, Ryota TERAUCHI1, Katsumi HISANO2, Hiroki ISHIKURO1, Shouhei KOUSAI1, Hiroyuki KOBAYASHI1, Hideaki MAJIMA1, Toru TAKAYAMA1, Masayuki KOIZUMI1 and Fumitoshi HATORI1
1 The authors are with Semiconductor Company, Toshiba Corporation, Kawasaki-shi, 212-8520 Japan. E-mail: kenichi.agawa@toshiba.co.jp, 2 The author is with Corporate R&D Center, Toshiba Corporation, Kawasaki-shi, 212-8582 Japan.
A frequency drift of open-loop PLL is an issue for the direct-modulation applications such as Bluetooth transceiver. The drift mainly comes from a temperature variation of VCO during the transmission operation. In this paper, we propose the optimum location of the VCO, considering the temperature gradient through the whole-chip thermal analysis. Moreover, a novel temperature-compensated VCO, employing a new biasing scheme, is proposed. The combination of these two techniques enables the power reduction of the transmitter by 33% without sacrificing the performance.
Thanks in advance!
A 2.4-GHz Temperature-Compensated CMOS LC-VCO for Low Frequency Drift Low-Power Direct-Modulation GFSK Transmitters
Toru TANZAWA1, Kenichi AGAWA1, Hiroyuki SHIBAYAMA1, Ryota TERAUCHI1, Katsumi HISANO2, Hiroki ISHIKURO1, Shouhei KOUSAI1, Hiroyuki KOBAYASHI1, Hideaki MAJIMA1, Toru TAKAYAMA1, Masayuki KOIZUMI1 and Fumitoshi HATORI1
1 The authors are with Semiconductor Company, Toshiba Corporation, Kawasaki-shi, 212-8520 Japan. E-mail: kenichi.agawa@toshiba.co.jp, 2 The author is with Corporate R&D Center, Toshiba Corporation, Kawasaki-shi, 212-8582 Japan.
A frequency drift of open-loop PLL is an issue for the direct-modulation applications such as Bluetooth transceiver. The drift mainly comes from a temperature variation of VCO during the transmission operation. In this paper, we propose the optimum location of the VCO, considering the temperature gradient through the whole-chip thermal analysis. Moreover, a novel temperature-compensated VCO, employing a new biasing scheme, is proposed. The combination of these two techniques enables the power reduction of the transmitter by 33% without sacrificing the performance.
Thanks in advance!
