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number of bonded IOBs

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malikkhaled

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anyone can explain me what is mean by number of bonded IOBs in FPGA, In my design i am using more than the available. what could be the drawback of it? please comments.
 

That means that you are using more pins on your FPGA than you have available, and the drawback is that you will never be able to implement your design in the FPGA package you have selected.

r.b.
 

That means that you are using more pins on your FPGA than you have available, and the drawback is that you will never be able to implement your design in the FPGA package you have selected.
r.b.

If malikhaled comes back and says it builds than the other drawback is the pins on the UN-bonded I/O aren't connected to any package pins. So the design will "fit" in the part/package but is not usable.
 

The drawback would be you need to spend more money on a bigger fpga device. Because <what rberek said/>.

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If malikhaled comes back and says it builds than the other drawback is the pins on the UN-bonded I/O aren't connected to any package pins. So the design will "fit" in the part/package but is not usable.

*grin* Are you using your voodoo powers? I thought of exactly that, and discarded it twofold. 1) naaaah, malikkhaled will not come back and say that and 2) if malikkhaled thought of that then he would not be asking this very question. Also see 1).
 

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