[MOVED]Use Bondpad in the Sch and Layout

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majun

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Hi,
I am new for the IBM SiGe BiCMOS 0.13um Process.
There are bondpad and bondpad_inh in the Schmatic,but no pad. There are bondpad and pad in Layout.
When I simulate the Schematic, should I put in a bondpad in my design? Or after layout design put in a pad in the layout.
and it is right and necessary to put a simulation term after the bondpad I/O?
 

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Re: Use Bondpad in the Sch and Layout

I would always include as many parasitics as possible (including bond pads) in the initial design and simulation. The alternative is that after completing the design and laying it out you then re-simulate to find out the bondpad has a significant effect and you have to start again.

Keith.
 

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