Re: LTCC Tutorials
Hello everybody,
Can anybody upload these papers...
• R.L. Brown, P.W. Polinski, “The Integration of Passive Components Into MCMs Using Advanced Low-Temperature Cofired Ceramics,” 1993 International Journal of Microcircuit and Electronic Packaging, v.16 n.4, pp.328-338.
• A Single-package integration of RF blocks for a 5 GHz WLAN application,. Advanced Packaging,IEEE Transactions on Components, Packaging and Technology, Part B: Vol. 24 Issue: 3, Page(s): 384-391, Aug. 2001
• William Blood, Feng Ling, Telesphor Kamgaing, Tomas Myers, and Michael Petras, "Simulation, Modeling, and Testing Embedded RF Capacitors in Low Temperature Cofired Ceramic," Electronic Components and Technology Conference, 2001, pp. 852-857
• Daniel I. Amey and Joshep P. Curilla, "Microwave Properties of Ceramic Materials," Electronic Components and Technology Conference, 1991, pp. 267-272
• W. Wersing, S. Gohlke, R. Matz, W. Eurskens, and V. Wannenmacher,” Integrated passive components using low temperature co-fired ceramics,” in Int. Microelectron. Symp., 1998, pp. 193–199.
• Ritter, A. Templeton, and B. Smith, “Multilayer cofired RC’s for line termination,” in Int. Microelectron. Symp., 1998, pp. 447–452
• J. Muller and H. Thust. “3D-intergration of passive RF-components in LTCC,” in Pan Pacific Microelectron. Symp. Dig., 1997, pp. 211–216.
These are not in the one kept by flyhigh (anyways thanks for ur cooperation). If someone has an access to these papers. Kindly upload it.
Cheers,