I am trying to improve the thermal path for the DFN-8 package and I wonder what kind of options do I have?. Can I just moves tracks around and and fill the area with copper, Could I put plated vias for better thermal management?.
I assume there are so much parameters. (PCB material, thickness, copper thickness, layer stacking, layer count, air flow...)
..it's hard to discuss without details..
I'd start with the "DFN-8 device's" datasheet and additional informations provided by the manufacturer.