Hi all,
I am looking for a statistics about rate of various kind of IGBT failures. I have searched the web but I couldn't find any information that has determined open-circuit (blow-up, bond lift up,...), short-circuit rates separately.
I would be grateful if somebody introduce me a reference that is include this information.
If you have a look at the Infineon website I seem to remember that there is stuff to explain this. I did a hi-rel project a couple of years ago and by far the best way to reduce an IGBT's life is to temperature cycle it. It is almost worth heating them when not in service such that their temperature is kept at a relative constant.