when I use the VIA2(Cylindrical via hole in microstrip) in @DS, there is a range of usage: 100um<H<635um, if I want to set PCBoard height as 1.6mm. How to ensure the model's accuracy?or is there another method for substitute? Thanks!
VIA2 model is based on the numerical analysis of Goldfarb and Pucel. And limitation of thickness came from this work. For this reason I recommend to use VIA model.
Models of passive components are matured enough. I used microstrip components library till 30GHz. Design was confirmed by HFSS simulation and tesing.