hi,everyone
I want to design RF-fornt IC tranceiver for wirless communication, traditionally, but how to isolation the receiver and transimitter block, any process constrains? such as STI?
yes, As is known, the receiver and transmitter end must be isolated effectively, and in order to do the sigle chip integration of RF-front end and baseband, I want to design the tranceiver front-end by TSMC or SMIC 0.18 RFCMOS or Normal-CMOS process, but how to understand the process relationship with this type RFIC? and how to select?