Hello
I am using the 45nm IBM-SOI toolkit of MOSIS to do my custom design. I wont be packaging my die and hence will be just using metal-pads. I will be appreciate it if any of the experienced designers over here can provide some insight on how to go about pad-design. I can understand these will be essentially metal-blobs but any pointers on how to determine the exact dimensions & spacing (based on landing area of probe?) and whether buffering circuits will be required will be really helpful.
Thanks
Basab