how to design pin assignment ?

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quan228228

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whe we do pin assignment, what should we consider?

And could you explain following terms:

1. bumping
2. Connect/Cut information between different power domains
3. multiple power ground domains


Any material about PAD welcome.


Thanks in advance!

quan228228
 

Help me!

quan228228

Added after 44 minutes:

I read the pad I/O spec of GSMC. it said the I/O pad support stagger I/O pads and inline I/O pad.

Pls explain, what is stagger and inline I/O pads, what's difference? or when we use stagger pads , when we use inline pads.


Thanks!

quan228228

Added after 1 hours 18 minutes:

Ok, could anyone explain what is pad ring, power ring and ground ring.


Thanks!

quan228228
 

Usually, the P/G of pads for a chip are connected which are called pad ring.
Power ring is the ring surrounding core for 1.8V (0.18um) power supply.
Ground ring is the ring surrounding core for ground purpose.It may also include the ground ring in pad connection.
 

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