Hi Folks
My current project has some tricky SMD parts and I think Ill prob need a hotplate.
Now I have hotplates available that are used to heat up liquid solutions in a lab etc but these look different from the type I see on Farnell....
Does anyone know if they will do the same job?
If they will it'll save me splashing out a couple hundred euro...
Thanks
I have some DFN package components and two bumped die parts an the board also lots of 0603 passives.
My main worry is the bumped die, they are very small (0805-ish) so the heat dissipates to a point and then they just burn up.
If I can heat the board with the plate, then use a gas gun to reflow it might be easier...
I've had success reflowing QFN packages on 0.4mm pitch but I imagine that chip-scale bumped packages would be more tricky (especially with hot-air methods)!
Do you have a solder paste stencil for the PCB?
I'd like to try using the "toaster oven reflow" method the next time I make something. I was looking at the reflow oven controller from PCB Pool's website, they also do a free stencil on certain orders. Maybe you are in a region they ship to?
În my opinion, hot air is much more at risk to burn components then a hot plate. Personally, I have good experience with a regular cooking plate, you don't necessarily need a temperature controller for it, just switch to medium power until the required temperature is reached, hold a few seconds, then take the PCB carefully off. No abrupt movements while the solder is liquid!