hbm class 0 components
Hello mixaloybas,
You will have to forgive me for being a little harsh but some of your understanding regarding ESD and handling are very naive and incorrect. Its not personal, I just want you to clear your mind a little and take a different approach to your mode of thinking.
I will start with this...the different ESD standards, such as HBM, MM, CDM are not true or exact representatives of ESD events, rather they model characteristics found in the infinite variety of ESD events, and each one attempts to model a certain variety of ESD events based on a simplified classification of ESD events.
Trying to solve HBM, by for instance using esd straps and mats is not a correct approach. When it comes to creating an ESD safe work environment...it is not from an approach of HBM, then CDM than MM...it is more or less a global "lets minimize all voltage fields in the area and potential current spikes". So my first advice is do not approach the design of an ESD work area by attempting to target the ESD standards...it doesn't work like that.
For your work area I would recommend referencing works such as this:
**broken link removed**
and taking a short course such as this:
**broken link removed**
Here is a very good compilations of training materials for ESD compliance:
http://www.automatedlearning.com/products/class_0_esd_article_links.cfm
There is a lot to consider in an ESD safe environment...one, of many examples, is ANY electronic equipment nearby can create problems...transformers, inductors, flowing current, power cables can all setup magnetic fields that can induce charge in parts sitting in a tray on your ESD work bench...you need to know how to look for problems such as that, these courses and information can teach you.
Now on to your wirebonding concerns...my first comment is that when handling your die, the first and primary events it will experience immediately prior to wire bonding is handling...the moment the die is removed from the package, it experiences an ESD event...it again experiences an event when placed on your PCB for wirebonding..you can't wirebond the die unless it is die attached to your PCB..usually through a ground plane-die flag. Unless your die is SOI, it will immediately discharge its entire substrate to the pcb when placed. As long as the bonder is at the same potential as the PCB, your bonding order beyond that does not matter. If however you are working with an exotic cmos chip, with fully isolated SOI, or so forth, the die attach will not immediate equalize the field between die and pcb..in which case your fist bondwire should be the largest on-chip ground...after that the rest of the die is at the same potential as the pcb.
Wirebonding is not your ESD risk...handling the part immediately prior to wirebonding is. My first recommendations is to ensure that your die are in ESD safe waffle packs...your handlers can have no major electrical components near the die that will potentially expose them to fields. Ground everything to die container first before picking a die...make sure the rest of the environment adheres to class 0 ESD standards as will be mentioned in some of the materials I posted links to. There is really so much more to consider that I feel even this last paragraph is incorrect as even a starting point. I can not do it justice in a message forum like this.
Good Luck!
-Srftech