I have a question about the glue mask layer. Are there any specifications (IPC, or otherwise) about where the glue should be placed, or should it just in general follow the outline of the components?
Some pcb layout software doesn't include a layer for the glue mask, but they have layers for solder mask, paste mask, etc.
If I send my design to an assembly house, do you know if they need the glue mask layer to mass-manufacture my boards or will it differ from house to house?