I'm an service electrician on drilling rigs, when spec'ing anything there are rules and regulations that make sure the job gets done right and that it's safe.
I follow the NEC and IEC here in America, I'm not sure who regulates the PCB design world, but I want to follow their standards to make sure all the projects
I'm working on get done right and safe.
The do I need to worry, was about EMI.
Since this is my first dive into the PCB design world, even at a hobby level, I want to learn the correct way of doing things so that I don't develop bad
habits that I will have to un-train myself later on down the road.
What I was thinking on the top layer was for heat spreading, I have vias connected to the bottom ground plane, then the connection is made at the PTH hole connection on the bottom, or would it be better to connect the bottom and top pours to the PTH?
Routing the traces without dropping to the bottom layer while keeping the PCB small, and current traces short is a PITA! Ha ha. But I see now the radiating current has to go around slots if you run traces through the bottom ground plane.
Some stuff I've dug up while google'ing, Image planes, the 20 x H or 100 x H rule, multi point and single point grounding, and partitioning.
The VCC plane is big and goes left and right, to handle the current and heat dissipation is what I had in mind.
I thought about putting this post in that section but after some thought I was thinking that section is related to software issues with design programs.
Thanks for the help guys! Appreciate you taking the time to help a noob out.
PS: Attached the SCH and BRD files, and a source for EMI tips you can let me know if it's good advice or not.
View attachment Desktop.zip