Emi suppression for component layer

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Dinesh2017

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Hi All,

I am working on high speed board design .my doubt is avoid emi problem i provided full solid copper plane in external layer after completing routing.whether work out this method it will create any problem in design.
any alternate method.can you provide suggestion.



Thanks and regards,

M.Dinesh
 

If the top layer is "full solid copper plane", how will there be components?

Flooding the outer layers with ground copper can make sense under circumstances, but you need sufficient vias to connect it. You find ground pours with via fences e.g. in RF PCB.
 
Hi Thanks for your reply.

i understand what your saying. whether this is applicable only high speed and rf or low speed signal board i can implement.
can you give some ref note.
 

Read info from the likes of Henry Ott, Ralf Morrison, Keith Armstrong (EMC UK)...
 

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