Hi, I understand that it is better seperate between analog vdd/gnd and digital vdd/gnd.
Typically, all pads have ESD protection. Thus, PAD has pad ring that provides vdd and gnd.
Should I separate ESD vdd and gnd from other power/ground?
In the process I am using, it has digital power pad and analog power pad - all pads are associated with ESD diodes. In the layout, all ESD diodes share vdd and ground without distinguishing analog and digital.
I found that I have to cut this power/gnd line so that I can separate digital vdd/gnd and analog vdd/gnd.
In the library I am using, there is cells called "power cut" cells. Some names that associated with these cells are DIODE_DIODE, SNAP_DIODE, DIODE_SNAP, SNAP_SANP.
Do you guys know what are the differences between them?
What is SNAP? It is defined as "low voltage REVERSE". I don't understand what it means.
Is there any body who has experience using POWER_cut??
In my PADs case, VDD and gnd that I use must be also used for ESD vdd/gnd?
Any other way, you would like to recommend??
Thanks in advance!!!!
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