I am looking for a rework station for soldering and desoldering of IC with power pad. That is IC with metal landing at the bottom for soldering onto the plane of the pcb for better heat conduction.
Never did that before, but perhaps you should consider the same nozzle set used for desoldering BGA components, although most of them are sold for use with both SMD/BGA packages.
The Nice Ladies In The Lab used a small heat gun and
gravity. Although a temperature-tolerant vacuum wand
or gently applied tweezers might be easier than working
upside down.