Sep 23, 2008 #1 H hiral.kotak Full Member level 2 Joined Aug 28, 2008 Messages 128 Helped 42 Reputation 84 Reaction score 31 Trophy points 1,308 Activity points 2,172 HI, Can anyone guide me about the CUP - circuit under pad structure and its placement during floorplanning? Thanks.. HAK..
HI, Can anyone guide me about the CUP - circuit under pad structure and its placement during floorplanning? Thanks.. HAK..
Sep 28, 2008 #2 R realtek Member level 5 Joined Mar 15, 2004 Messages 89 Helped 1 Reputation 2 Reaction score 1 Trophy points 1,288 Activity points 870 in during floorplanning? you can take CUP as a normal IO PAD ! ( read the .lef for placement)
Sep 29, 2008 #3 H hiral.kotak Full Member level 2 Joined Aug 28, 2008 Messages 128 Helped 42 Reputation 84 Reaction score 31 Trophy points 1,308 Activity points 2,172 ya. Tell me about the internal structure of CUP and comaprision of it with simple wire bond for stress point of view. Thanks.. HAK..
ya. Tell me about the internal structure of CUP and comaprision of it with simple wire bond for stress point of view. Thanks.. HAK..
Nov 1, 2008 #4 S sunjimmy Full Member level 2 Joined Jan 10, 2003 Messages 128 Helped 9 Reputation 18 Reaction score 7 Trophy points 1,298 Activity points 1,027 Compared to convential PAD structure, the ESD ckt is put under PAD. So the dimension of I/O pad is reduced. (because in the conventional PAD structure, the ESD ckt can't be put under PAD, so need more area for ESD ckt)
Compared to convential PAD structure, the ESD ckt is put under PAD. So the dimension of I/O pad is reduced. (because in the conventional PAD structure, the ESD ckt can't be put under PAD, so need more area for ESD ckt)