Hi guys,
Both structures are having same thermal gradients, process variations (etching, oxide thickness etc)
I think 2nd pattern is good, because evenly distributed in that structure.Anyway in deep submicron we are not doing diffusion sharing, if we use sharing then 1st pattern is better, because area will reduce.
remaining the sharing, both structures are having same effects, but 2nd is better a bit more.
If it is in one row then 1st is better, means ABBA is betterthan ABAB to nullify the Thermal gradients
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