ceramic vs. plastic package

[senmeis]

Hi,

what is the greatest advantage of ceramic package over plastic package for ICs? As far as I know ceramic packages are bigger and heavier.

 

[barry]

Ceramic packages are used for high temperature and mil-spec parts

 

[schmitt trigger]

They are also fully hermetic.

 

[dick_freebird]

Plastic packaging mold compound can be a source
of mobile ion contaminants, although this "should"
not happen if feedstocks are sourced from top grade
vendors. Plastic packaging can absorb moisture in
condensing atmospheres and then "popcorn" when
ramped to >100C.

Ceramic packages with a hollow cavity can have particle
contamination from the environment or the sealing
process. Hermeticity cannot be assumed as pinholes
and lid misalignment and loss of the preform solder
can all happen. So for true HiRel parts there is a lot of
post-assembly mechanical testing that adds bigly to
cost.

Setup for plastic packaging tends to be more expensive
as it's become oriented to high volume automated
assembly. There are some vendors of "open cavity plastic
packages" which offer the flexibility of ceramic open
cavities, but cost closer to plastic.

 

[KlausST]

Hi,

Just guessing
* high temperature
* low leakage currents
* due to high mechanical stability low electrical drift

Klaus

 

[HardwareBee]

If your design allows - use plastic packages, they are much cheaper and fit to most applications. Ceramic packages are mostly for high end and space applications. You can read here about semiconductor packaging, QFN and BGA package type:

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