I designed a CMOS bandgap, in which there is an op amp. When I measured the bandgap's output, I found this value changes from chip to chip. So what could be the reason causing this change. Thanks!
how can bonding and package affect the output? i my opinion, the bonding wire contains only ind and cap which wouldn't affect DC point. is it something to do with stress? or other factor?
There are strain effects from packaging, piezoresistive; I've seen some people lay out
their bandgap resistors at 45 degrees because it gave them a little bit less. Seemed
like overkill to me but they swore by it.
Are you really expecting your CMOS op amp to have less than 10mV random Vio
scatter? Good luck with that.