Antenna_Conception_Problem

[hot_snow]

Hello,

I'm designing a Zigbee module with a TI antenna design.

I make the Antenna with the fill copper option of AD10. Well, when I added a two pads to the fill copper of the antenna I found two errors violations:

1- Clearance Constraint (Collision < 0.2 mm) Between Fill on BottomLayer And Pad on BottomLayer.
2-Short-Circuit Constraint Between Fill on BottomLayer And Pad on BottomLayer.

Can these errors make a problom of signal transfer in my PCB?

One other question: I found in the layout design of TI that their own PCB contains thru-holes vias and blind vias (L1-L2 and L3-L4).

Have I to use blind vias in my design? or I can only use thru-holes ones?

Thanks,

 

[Shehata]

do u want to send ur antenna schematic and i can simulate it