datasheet001
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A 250A surface-mount power MOSFET transistors, this product has a market, the lowest on-resistance can be reduced to the minimum power conversion loss, and improve system performance. STV250N55F3 new products is the market's first integrated STPowerSO-10 ™ package and the lead solder with wedge bonding power MOSFET, no bare-chip packaging with low resistance. ST's new products STripFET III ™ high-density process, the typical on-resistance of only 1.5 cents in Europe. More STripFET III benefits include: lower switching loss, anti-avalanche performance. In addition to improving thermal efficiency, nine lines connecting source configuration also help to reduce resistance. At 25 ℃, rated power package for the 300W. New high-rated current so that engineers can design a number of parallel MOSFET, to achieve savings in board space and materials costs. Standard pressure-driven threshold also helps to simplify the driving circuit design. STV250N55F3 applied to the electrical equipment of up to 55V. 175 ℃ up to operating temperature so that the current strong STV250N55F3 for electric traction equipment, such as forklifts, golf cars and electric pallet truck loading and unloading as well as the mower, electric wheelchairs and electric bicycles. New products and finished in the wafer stage are 100% avalanche tested for reliability and against wear and provide a strong protection. New products will soon be automotive-grade products to meet quality standards. Products in the same series, ST was also a model for the 55V STV200N55F3 products, the product of the rated continuous drain current of 200A, the source is configured to 4-wire connection. Samples instantly STV250N55F3 sale is expected to mass production of the third quarter of 2008.
