These are conducting vias that connect the top layer ground plane to the main bottom layer. This insures that they are at the same potential at all locations.
Flatulent is right. These vias are mainly useful close to the RF tracks on the Ground plane Edge. They have to be separated by a distance less than λg/10 with λg= Co(light velocity)/(fo * √εr).
Added after 44 seconds:
Flatulent is right. These vias are mainly useful close to the RF tracks on the Ground plane Edge. They have to be separated by a distance less than λg/10 with λg= Co(light velocity)/(fo * √εr).
are there any useful references talking about these high frequency PCB board layout issues and tricks?
Thanks.
flatulent said:
These are conducting vias that connect the top layer ground plane to the main bottom layer. This insures that they are at the same potential at all locations.