Manufacturers seldom give out details but you may
sometimes find such info "escaping" through their
reliability reports (which will call out their name for
the process flow) and follow that thread to find any
other stray bits of info about technology attributes.
You can make some guesses about geometries like
- about 6V/um of "Leff" for breakdown (abs max
pin-pin on the switches)
- 7MV/cm on the gate oxide, which would be switch
pins to VS-, VS+ abs max rating, for a single symmetric
lateral MOSFET in an analog switch.
Die size should be called out in a die-level product
datasheet if the manufacturer does that kind of
business. Starting material and construction you
may (or not) find in those reliability reports (if the
mfr puts those on their product web pages).
I see little of that on ST's pages.
The technology info I see on the datasheet front page
makes me think this is a 3.3V BCDMOS technology that
uses some cleverness to drive NMOS high side switches.
Those switches may not have as thick an oxide as a
regular analog switch because the function is not
bidirectional, rather a high-side power switch, so a
LDMOS could do the job. Tox could be as low as 90A or
so.
You could probably learn some stuff if you removed
the encapsulant over the die and took a look through
a microscope.
Hello I am having difficulties regarding finding information related to a STHV64SW chip, information such as channel size, oxide thickness, which materials have to be made, size. Someone know how to guide me to find this information.