I agree with all above posts. My only warning is - if you are assembling the boards using a standard stencil, you may want to deviate from the standard 5-mil steel and reduce to a 4-mil or 3-mil. Even if paste is applied to each pad properly, the surface tension during reflow will cause a bit of movement. The risk is that you will end up with a solder bridge, which is the worst to fix on 0201's due to their size.
Also note that many assembly companies want some amount of space between components - not between the pads but between the outside of components, as pick and place machines all place within tolerance. You don't want to have one resistor placed a degree or two off and have it bumped off the pads, causing a ton of rework later.