Anklon
Member level 1
When I use "Route->Metal fill-> add " option in INNOVUS , along with the metal dummy layers, it also place many vias across the core. I have found no option to prevent this. Why this via's are placed along with metal fill ? what kind of purpose this serve ?
There is an option for via fill in "Route -> via fill -> add" so that one can include via fill if needed. I have found no need to add some vias along with metal fill by default .
My DRC rules does not check for VIA FILL percentage, so I was thinking to about that for now. But If I do not perform VIA FILL after METAL FILL , via's placed during METAL FILL operation causes DRC error.
Any link of resources for better understanding will be appreciated. I'm using TSMC180 technology.
Thank you for your time.
[SN: I have posted this question before. As this question have some common concept related to my previous post, moderator make this post as a comment of that previous post hoping people from that post could answer that. After coup of day, as I get no feedback or response I decided to post it as individual post.]
There is an option for via fill in "Route -> via fill -> add" so that one can include via fill if needed. I have found no need to add some vias along with metal fill by default .
My DRC rules does not check for VIA FILL percentage, so I was thinking to about that for now. But If I do not perform VIA FILL after METAL FILL , via's placed during METAL FILL operation causes DRC error.
Any link of resources for better understanding will be appreciated. I'm using TSMC180 technology.
Thank you for your time.
[SN: I have posted this question before. As this question have some common concept related to my previous post, moderator make this post as a comment of that previous post hoping people from that post could answer that. After coup of day, as I get no feedback or response I decided to post it as individual post.]