ling4ever
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I am starting designs for burn-in boards and hast boards. I am thinking to edit my via padstack that it will connect to internal copper planes through spoke/thermal connection. I would like to know if anyone here has tried this before. And does this really make a difference on the performance during burn-in compared to a directly connected via? Need help. Thanks
P.S. The board thickness is 62 mils. This have a four layer stack up. Burn-in temp is +125C for 1000 hours.
P.S. The board thickness is 62 mils. This have a four layer stack up. Burn-in temp is +125C for 1000 hours.