Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
First you need to define the copper pour outline (if the flooding is done on a routing/outer layers). In this process carefully define the borders of copper pour area. Once this is done the tool will automatically isolate the areas that need not be filled and also create the thermal pads on all those pins which are to be connected to the copper pour. Then do the Copper pour / flood. And you will see that respective pins (which are connected to the pour) will be automatically connected to the pour area. Another thing- make sure to assign the net name GND/VDD to the copper pour area after it's been created.
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.