Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

Why Wire Bonding uses Au(gold)?

Status
Not open for further replies.
M

mailrapid

Newbie level 6
Joined
Dec 21, 2007
Messages
11
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Activity points
1,356
As we know, when it comes to wire bonding, we can image that it is "Au" bonding.

Byt why not uses Ag or Cu bonding instead of Au?
 

The main reason is that it is relatively flexible compare to copper. It is one good advantage during packaging process
 

Byt why not uses Ag or Cu bonding instead of Au

Au is less prone to environmental damage on the long run so build up of high resistance or bad contact is avoided on the long run
 

Both Ag and Cu corrode in one form or another leaving non-conductive deposits on the surface. Au does not.
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top