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[SOLVED] help for over-current protector in LDO

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chaojixin

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Hi, every one!
I'm on the design of a 2.5~4.2V input, 1.8V output, 400mA LDO(CMOS process), and a over-current protection is needed.
What's the most used method in product?

the academic papers usually present a current mirror method as shown in the figure but I think the mismatch is high because the 'n' is always 1000 or even larger. does the product always use this method?
 

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Well, if the 2.5-4.2V is from the output of another regulator, do you really need an over current protection ? I don't think so....
 

... I think the mismatch is high because the 'n' is always 1000 or even larger.
We used not a single Sensor MOS, but several of them, well distributed between the Power MOS fingers. The matching was quite adequate.
 

---------- Post added at 11:01 ---------- Previous post was at 10:37 ----------

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We used not a single Sensor MOS, but several of them, well distributed between the Power MOS fingers. The matching was quite adequate.
thank you! But how much precision is adequate in general? I want do some calculation and simulation

---------- Post added at 11:01 ---------- Previous post was at 11:01 ----------

Well, if the 2.5-4.2V is from the output of another regulator, do you really need an over current protection ? I don't think so....
it is from Li-on battery. in what condition an over current protection is not needed? I find that many datasheets of product present this feature
 
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... how much precision is adequate in general? I want do some calculation and simulation
I think a ±10% precision is adequate for over-current protection. See the dataSheets of commercial LDOs.

As we used a trimming scheme for Vref anyway, we also had the chance to select and arbitrarily add the currents of several (distributed) sense current fingers, so eventually even came closer to the intended current limit.

Another hint: Use sense resistor(s) with positive TC and put it/them close to the power MOS .

For high current LDOs (>≈ 20..50mA) a bend-back I-V characteristic is preferable.
 
I think a ±10% precision is adequate for over-current protection. See the dataSheets of commercial LDOs.

As we used a trimming scheme for Vref anyway, we also had the chance to select and arbitrarily add the currents of several (distributed) sense current fingers, so eventually even came closer to the intended current limit.

Another hint: Use sense resistor(s) with positive TC and put it/them close to the power MOS .

For high current LDOs (>≈ 20..50mA) a bend-back I-V characteristic is preferable.

I haven't heard about the 'bend-back I-V characteristic' method, can you please give a list of reference?
 

I haven't heard about the 'bend-back I-V characteristic' method, can you please give a list of reference?
Guess I've used the wrong English designation, sorry! Search for "foldback current limiting" via G00gle images!
 
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