T
treez
Guest
Hello,
We have power packages which are hot when running. (they contain power FETs and control circuitry)
I just noticed yesterday that the bottom layer has solder seeped out onto the bottom layer thermal copper...seeped out through the thermal vias in the pad of the packages.
Is this likely to have happened...
1....during production soldering of the board?
2...during some of our testing operations where we run the board?
The bottom copper has no solder resist over it, as it sits on a rubber pad on a heatsink.
We have power packages which are hot when running. (they contain power FETs and control circuitry)
I just noticed yesterday that the bottom layer has solder seeped out onto the bottom layer thermal copper...seeped out through the thermal vias in the pad of the packages.
Is this likely to have happened...
1....during production soldering of the board?
2...during some of our testing operations where we run the board?
The bottom copper has no solder resist over it, as it sits on a rubber pad on a heatsink.