[SOLVED] Should I bake old BGA parts before soldering?

Dear experts,

I have a variety of stored components, some of them were bought last year, some early this year. These components include moisture sensitive BGA CPUs, DDR2 memory chips and so on.

I wonder if in a new board I can still reuse the stored components? These components have been taken out of distributor’s sealed package after I received them, and I place them in plastic boxes without putting a desiccant beside them. They have then been kept in my room which I would say is not humid/damp as much as I could feel.

Information on **broken link removed** suggest that:

1. Moisture will expand during reflow and could cause cracks or delamination of ICs.
2. If one have soldered components containing moisture and later have identified problems, they cannot fix that by simply re-baking. Replacement would be needed.

However, since I am now aware of the problem, may I bake the component prior to soldering? My assembly house / solderer advised that BGA components be baked for 24 hours before soldering, would that bring ICs, some stored in air for over a year since my last April’s order, back to their dry and pristine state?



Jacky

just try to blow with hair dryer if only moisture is concern

bhav,

Just asked a factory and they say they will bake the old BGA chips prior to soldering, and this guarantees that moisture is removed. Same thing