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Hello,
Anybody know about chips.prt file (DE HDL) and how we can use it to combine all ref des (homogeneous & heteregeneous) logical part in one .dra file?
Anyway, I'm able to do the pin swapping, but the problem is when I do it, the pin is actually moving from it current location. How to make the net name/offpage connector swap instead of the pin.
Anybody know how to do Capture CIS back annotation like something on the pics. After route the pins on the allegro, back annotate on the capture will automatically assign the channel pin name/number. Do we need something like script to be able to do this process?
"Trace length variation across DUTs should be kept within ±100ps."
Anybody know how much "±100ps" is in any measurement (inch@mils)?
Or anybody have formula on how to calculate it for certain material such as Nelco 13 or FR-4.
Pls help me!!
Thanks all.
And how if the material is being press. Because in fab, they're going to press the material right to get the desired thickness. Is it gonna change the dielectric also?
current to drive 50 ohm
yes, the trace thickness won't be critical, how about the impedance match? do i need to sandwich each signal layer with gnd and set the layer to 50 ohm?
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