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hi:
I want to help you, i have been used OMAP....,can you any question to ask,please cantact me;
my email:johnstonick@outlook.com, I will give you details that you wanted.
1.P/P is a semi-finished product, for good production and layers symmetric;
2.The same FR-4, may be FR-4 dielectric constant have some different depending on your board thickness and impedance control.
Dear viperpaki007,
you can made differential 8GHz signal etch line as short as possible, via is less than 2/etch line, impedance controlled.Simulation optimization via may be perfect. all for RF-4 purpose.
HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc. Surface treatment only affects the reliability and cost, normally ENIG is ok.
Deal kapil,
Generally speaking, FR-4 is ok, if multilayer board used high TG FR-4 is better(above 6L); For RF board ,if you board have microstrip filter or sensitive to characteristic impedance shoud use low dielectric loss materals like Rogers; For high speed design, if your PCB etch line not...
Your PCB board is really small, SMT machine can't handle it, so you need panel a big one, the panel PCB board size should be bigger than 100mm*100mm is prefect.
1\Shape thermal relief orthogonally connects to SMT pins, through pins, that would be best;
2\Shape clearance in the range of 0.3~0.5MM is perfect;
3\you can use thick lines, big vias. to save costs
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