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We need to achieve all of these together.
Only power might be a issue in low power.
Apart from that all the others r required.
You need to signoff with the all the above checks.
I guess if ur keeping the logic together close enough the tool might try to put buffers in the common path.
Also the CG cells placement matters here.
If u have to split the logic group to two u can make two branches of CTS.
This might also help.
What I have observed is that a single buffer delay is not exactly two buffers delay.
So if u need less delay and less power dissipation then u go for more buffers.
If u need good slew and better pulse width invs will be the good choice.
Normally the tool adds buffers at the root and invs at...
The test path is just a data path without the comb logic in between the flops. So normally u dont get setup issues but many hold violations. But now as we are moving towards 32nm we are seeing both the violations.
After ur chip has been manufactured then the testing takes place on ATPG...
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