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I think inductance will come in picture when metal winding is more , meance round shape metal for ex. M1 to M5.
In layout will draw metal as straight for routing purpose, there inductance is negligible.
Hi,
I hope before merge you did ctrl+A (select all layout data)
May be there is no scope for merge.
When same layer overlap with different polygon then merge will work.
This error is rule defination? What is the rule defination. Some time rule is big then DRC develper will wrote multiple rule for one rule
for EX: rule_branch1 , rule_branch2 ......
Re: Dcap in analog layout
Yeah dcap means decoupling capacitor.
Which type of high accuracy is needed??
Added after 5 minutes:
Is there any limitation for W and L OR we can take any large W/L
DFM issue
ameed I agree with u.
The Layout designer should take care of DFM.
It is very important of following points:
Yield
Performance
and
life time of chip.
It is slightly increase area and no of chips per wafer is reduce 10% but performance is 99% good.
DFM is very big issue in VLSI.
In The TSMC file it given.
In Cadence u can take directly instance, for different technology.
If u want to understand fab process use Gandhi book.
............................
layout design
ameed,
I think if technology is shrinking then voltage level also going down. on chip area will take less there DRC rules are changing. Power will increase. I don't know @ speed. you should take care @ electro migration. Channel length will decrease then speed will increase...
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