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I like the idea of chip-on-board. I think I'll invest a little more time in combining all the common amplifier signals to common pins, and wire bond these to a board. I can then probe each amplifier's input/output (differential, so 4 pins) with standard probes for characterization. As long as...
We are working in a 0.35um TSMC technology and I am in the process of designing a test chip that is to be used to characterize some analog amplifiers used in the actual design. In the actual design, these amplifiers require about 40 I/O pins due to digital configuration bits, digital power...
We are working in a 0.35um TSMC technology and I have been using the Tanner Hi-ESD Pad library as a guide for designing our pads (digital I and O, analog references, analog out, and power). In this library, and the others that I can find online, the pad is normally only connected to using M1...
Hi All,
I'm in the middle of a mixed-signal design project using the TSMC 0.35um 2P4M process. I've done some chip layouts in 0.5um before during undergrad, but this is my first time using 0.35um. I have a few questions and concerns:
I've created some custom digital standard cells to do the...
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