Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
Wafer clean is made after and before any step in the process.
So both implantation and diffusion can follow wafer clean.
As for difference between implantation and diffusion, both have a strict narrow definition and a tech slang one. Strictly speaking diff and imp are completely diffrent process steps having nothing in common. If you meant technical slang, please define your question in a more exact manner.
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.
