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Probe pads are not foundry dependent. Rules, sizes, etc. depend on the probing equipment to be used.
Usually you'll have a required minimum passivation opening size and, there, you'll have a limitation (by process) to place devices or lines closer than x microns to that probe pad passivation...
That's about "probe pads", you'll also have other testing pads usually named "engineering pads", in addition to the also usual "bond pads", but I only explained the first ones since I guess it was your question...
Probe pads are the pads which are not connected directly to the out side world through the pin of the Ic but they are placed just to measure the required voltages or currents by using some precize probing methods.
Basically we use the probepads when we want to know the o/p of particular net but that o/p doesnot need any pin.
Probe pads are basically test pads to know voltage or current at that point.
In general for critical points (places), we put test/probe pads.
The layout rules for probe/test pads are in process file (DRC file)
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