Partial lifted wire bond

[siva_7517]

Is there any method to test MMIC chip (SOT package) for partially lifted wirebond from die using electrical test? Thanks.

 

[marce]

X ray the chip if your production dept has an x-ray machine.

 

[siva_7517]

Thanks for the reply. X-ray only will be conducted on the sample products. I would like electrical test method to see if the bond is lifted for all the units in production? example: the resistance of lifted wirebond will be high.

---------- Post added at 09:11 ---------- Previous post was at 09:10 ----------

I mean partial lifted (that mean it still have a physical touch with the bond pad)