predator89
Member level 1
Hello,
I am learning to create a pad ring for a mixed signal SOC.
Few point I have understood so far are:
1. Have separate Analog and Digital ground and power pins to isolate the noise from both the blocks.
2. Multiple pads for pad supply and ground pin, this is to reduce the equivalent inductance from bond wire.
3. Input pads should not be close to power or output pads.
I would like to know if there are any more rules i should follow to reduce the parasitics and noise coming from pads, which I can compensate during pad ring design for mixed signal SOC.
Any suggestions are appreciated.
Thanks.
I am learning to create a pad ring for a mixed signal SOC.
Few point I have understood so far are:
1. Have separate Analog and Digital ground and power pins to isolate the noise from both the blocks.
2. Multiple pads for pad supply and ground pin, this is to reduce the equivalent inductance from bond wire.
3. Input pads should not be close to power or output pads.
I would like to know if there are any more rules i should follow to reduce the parasitics and noise coming from pads, which I can compensate during pad ring design for mixed signal SOC.
Any suggestions are appreciated.
Thanks.