odesus
Member level 1
Dear Comunity:
Actually in Market, there's a relatively new technology for System on package design known as POP Package on Package design. I know amkor enterprises is leader on this field.
For example, If I want to have a configuration (as a sandwitch): microprocessor, DRAM memory and FLASH memory; Could I implement this technology easily? I mean POP technology uses specials bases for make BGA stackable, or Do I need to send my design to Amkor asian ovens? That's means this technology is not suitable for small amount of devices.
I really appreciate any information you can provide me, many thanks.
Actually in Market, there's a relatively new technology for System on package design known as POP Package on Package design. I know amkor enterprises is leader on this field.
For example, If I want to have a configuration (as a sandwitch): microprocessor, DRAM memory and FLASH memory; Could I implement this technology easily? I mean POP technology uses specials bases for make BGA stackable, or Do I need to send my design to Amkor asian ovens? That's means this technology is not suitable for small amount of devices.
I really appreciate any information you can provide me, many thanks.