nkp6195
Newbie level 4
Dear All,
I am working on a reliability test chip and need to stress devices way higher than normal. The chip is all about stressing devices and sensing voltages. The nominal domain (consisting of shift register, etc) has a good amount of decaps but I am considering not to add any decaps to the stress domain (esp. since testing has to be carried out at high temperatures where unnecessary stress on decap oxide will be incurred leading to not only leakage but TDDB).
Do you suggest not adding decaps on chip can cause any problems ? I plan to add decaps externally on pcb.
Thanks in anticipation.
I am working on a reliability test chip and need to stress devices way higher than normal. The chip is all about stressing devices and sensing voltages. The nominal domain (consisting of shift register, etc) has a good amount of decaps but I am considering not to add any decaps to the stress domain (esp. since testing has to be carried out at high temperatures where unnecessary stress on decap oxide will be incurred leading to not only leakage but TDDB).
Do you suggest not adding decaps on chip can cause any problems ? I plan to add decaps externally on pcb.
Thanks in anticipation.