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Do any one know the detail of COF ( chip one film ) package?

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EDA_hg81

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going to design PCB based on COF package?

Do any one know the size detail of COF ( chip one film ) package?

Thanks
 

Re: Do any one know the detail of COF ( chip one film ) pack

Die size depends, you have to refer the specification. If you are using PADS or Allegro Package Designer (APD), you define the correct pad size by feeding dimension.

Gold wires are used to bond between the outer pads & the die. Similae to one if you look thru the glass window of EPROM.
 

    EDA_hg81

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